Dwarkesh Podcast · Thursday, October 22, 2026
Intel engineering leadership detailed the long-term roadmap for transistor development, highlighting the exploration of ruthenium to replace copper lines at very fine pitches and the investigation of stacked complementary field effect transistors (CFETs) to continue scaling beyond standard gate-all-around architectures.
“Ruthenium starts to win. So there is a crossover point that ruthenium will have much better conductivity, better resistivity than copper.”
“That evaluation of CFET is currently underway, not just by us, by our competition, Labs externally are looking at it. It is the ultimate in stackability.”